Equipment&Charges

■Microstructural Characterization   ■Molecule & Material Synthesis
■Nanofabrication(MEMS)   

Microstructural Characterization
■Technical support charge: 3,000 yen/hour
■Sample preparation room:300yen/hour
Equipment usage Charges【yen/day(8hours)】
Equipment name
Open Project
Classified Project
SU8000
10,345
29,081
FEI-Titan80-300
30,156
63,660
FEI−Quanta3D
22,003
31,543
FEI−Versa3D
22,003
31,543
JEM-ARM200F
27,200
72,000
Titan³ 60-300
35,930
64,935
Titan³ 60-300
32,337
58,441
Topcon EM-002B 23,200 48,800
JEOL JEM-2000EXU 14,400 30,400
JEOL EM-09100IS 16,800 30,400
※Microstructural Characterization:All charges listed here are before tax.
Molecule & Material Synthesis
Equipment name
Charges
 
Consumables
costs
Open Project
Classified Project
 
Independent Operation
Assistant Operation
Integrated Support
Independent Operation
Assistant Operation
Integrated Support
 
Separately negotiated
Thermoanalysis
238 1,231 1,728 983 1,480 2,722
yen/
hour
X-ray Diffractometer
1,247 2,241 2,738 1,993 2,489 3,731
yen/
hour
Nuclear magnetic resonance (NMR)
5,200
32,100
yen/
hour
ICP optical emission spectrometer
3,200
4,600
yen/
hour
Molecule & Material Synthesis
・Raw chemicals for syntheses are not included.
・All charges listed here are including tax.
Nanofabrication(MEMS)
【Open Project】
■Technical support fee: 3,150 yen/hour  
■Facility usage charge: 980 yen/hour(830 yen/hour for the use within the Universityr )

【Classified Project】
■Technical support fee: 6,306 yen/hour  
■Facility usage charge: 980 yen/hour(830 yen/hour for the use within the Universityr )

Price List(PDF)
No.
Equipment name
Charges
(yen/hour)
No.
Equipment name
Charges
(yen/hour)

A.Cleaning & drying

A-1
Draft chamber
1,056
A-7
Spin-drying machine
1,940
A-2
Draft chamber for SiN etching
1,380
A-8
Organic draft chamber
1,056
A-4
Inert oven for sintering
1,114
A-9
4" spin drying machine
1,664
A-5
Vacuum oven
860
A-10
6"spin drying machine
1,664
A-6
Brush scrubber
4,242      

B.Photolithography

B-2
Spin coater
1,826
B-11
Spray developer
1,834
B-3
Clean oven
2,424
B-13
Elionix EB lithography
8,742
B-4
Curing oven
1,754
B-14
Laser writer
6,824
B-5
Double-side aligner
2,818
B-15
Maskless exposure system for ball
4,206
B-8
Draft chamber for development
1,056
B-16
Spin dryer
1,940
B-9
UV curing
3,052
B-17
Hot plate
928
B-10
Spin coater
2,026      

C.Oxidation/diffusion, ion injection and heat treatment

C-1
Oxidation furnace (for semiconductors))
9,652
C-7
Annealing furnace
9,176
C-2
Oxidation furnace (for MEMS)
8,248
C-8
Medium-current ion injector
18,958
C-3
P diffusion furnace
10,598
C-9
High-current ion injector
18,750
C-4
P push-in furnace
8,922
C-10
Rapid thermal annealing
7,256
C-5
B diffusion furnace
9,986 C-11
Metal diffusion furnace
8,638
C-6
B push-in furnace
8,922  

D.Deposition

D-1
LPCVD(SiN)
9,870
D-11
Plating equipment
2,436
D-2
LPCVD(Poly-Si)
9,918
D-12
MOCVD
18,784
D-3
LPCVD(SiO2)
10,548
D-13
JPEL PECVD
14,454
D-4
CVD
19,828 D-14
TEOS PECVD
16,316
D-5
SUMITOMOSEIMITU PECVD
14,358 D-15
Automatic Shibaura
sputtering
5,988
D-6
W-CVD
8,970
D-16
Sputtering for ball
3,986
D-7
ANELVA sputtering equipment
7,164 D-17
ALD
9,546
D-8
SHIBAURA sputtering equipment
3,510
D-18
High-temp. sputtering and O2 annealing
11,078
D-9
Electron beam evaporator
6,508 D-19
Anelva multi-sputtering
5,536
D-10
Sol-gel auto-deposition system
6,804
   

E.Etching

E-1
DeepRIE #1
7,908
E-11
KOH etching equipment
2,994
E-2
DeepRIE #2
7,908
E-12
TMAH etching equipment
3,002
E-3
DeepRIE #3
8,306
E-13
DeepRIE #4
14,806
E-4
ANELVA RIE equipment
6,610
E-14
Ion milling
10,982
E-5
ANELVA Si RIE equipment
6,018
E-15
Vapor HF etching
8,170
E-6
Al-RIE
10,294
E-16
Ulvac ICP-RIE#1
15,040
E-7
ULVAC ashing equipment
3,598
E-17
Chemical Dry Etcher (CDE)
5,690
E-8
BRANSON ashing equipment
3,054
E-18
Plasma cleaner
3,090
E-9
ECR etching equipment
14,270
E-19
Ulvac ICP-RIE#2
14,834
E-10
ULVAC multi-purpose RIE equipment
9,656  

F.Bonding, polishing and packaging

F-1
Wafer bonding equipment
4,996
F-9
EVG wafer bonder
5,142
F-2
TOKYO SEIMITSU dicer
9,312
F-10
EVG aligner for wafer bonding
4,364
F-3
DISCO dicer
2,398
F-11
UV imprint
5,582
F-4
Wire bonder
1,122
F-12
Thermal imprint
5,212
F-5
Laser marker
2,332
F-13
Excimer lamp cleaner
1,946
F-6
6-inch wafer polishing equipment
2,032
F-14
Surface planer
12,342
F-7
4-inch wafer polishing equipment
1,742
F-15
Shibuya LAMICS AQL-1900
5,478
F-8
Sand blast
3,100

G.Measurement

G-1
Wafer dust detector
1,670
G-15
Ultrasonic microscope
2,156
G-2
Film thickness gage
1,312
G-16
Digital thermo microscope
1,180
G-3
Dektak step profiler
1,584
G-17
Infrared microscope
1,166
G-4
Tenchor step profiler
1,584
G-18
Quadrupole mass analyzer
1,160
G-5
Depth measuring equipment
1,012
G-19
TOF-SIMS
14,830
G-6
4-probe measuring equipment
1,014
G-20
Quick coater
1,266
G-7
Spreading resistance profiler
2,526
G-22
Desktop Ellipsometer
690
G-8
Wafer prober
2,568
G-23
Large wafer size AFM
3,938
G-9
Metal microscope
1,088
G-24
Laser/white light conforcal microscope
4,598
G-10
Digital microscope
1,468
G-25
Line-focus-beam acoustic microscope for material characterization #1
3,242
G-11
Thermal electron SEM
2,448
G-26
Line-focus-beam acoustic microscope for material characterization #2
3,242
G-12
FE-SEM
4,146
G-27
FIB
9,244
G-13
Micro X-ray CT
2,986
G-28
XRD
7,176
G-14
Ellipsometer
910  
※Nanofabrication:All charges listed here are including tax.