nanotech_japan

Equipment&Charges

■Microstructural Characterization   ■Molecule & Material Synthesis
■Nanofabrication(MEMS)   

Microstructural Characterization
■Technical support charge: 3,000 yen/hour
■Sample preparation room:300yen/hour
Equipment usage Charges【yen/day(8hours)】
Equipment name
Open Project
Classified Project
SU8000
10,512 29,248
FEI-Titan80-300
29,705 34,105
FEI−Quanta3D
23,120 33,112
FEI−Versa3D
23,120 33,112
JEM-ARM200F
24,000
64,480
JEM-3010
14,942 25,654
※Microstructural Characterization:All charges listed here are before tax.
Molecule & Material Synthesis
Equipment name
Charges
 
Consumables
costs
Open Project
Classified Project
 
Independent Operation
Assistant Operation
Integrated Support
Independent Operation
Assistant Operation
Integrated Support
 
Separately negotiated
Types of synthetic equipment and analyzers
1,220 8,672
yen/
day
Triple Glove Box with Deposition Chanber
2,613 3,606 4,103 3,358 3,855 5,097
yen/
hour
Degital Camera
Optical Thickness Meter
Manual Positioner
Semiconductor Device Analyzer
Thermoanalysis
238 1,231 1,728 983 1,480 2,722
yen/
hour
Absolute PL Quantum Yield Measurment System
334 1,327 1,824 1,079 1,576 2,818
yen/
hour
Photoemission Yield Spectroscopy in Air
1,042 2,036 2,533 1,787 2,284 3,526
yen/
hour
Time of Flight Carrier Measurement System
627 1,621 2,118 1,373 1,869 3,111
yen/
hour
X-ray Diffractometer
1,247 2,241 2,738 1,993 2,489 3,731
yen/
hour
Nuclear magnetic resonance (NMR)
5,616
34,668
yen/
hour
ICP optical emission spectrometer
3,456
4,968
yen/
hour
Molecule & Material Synthesis
・Raw chemicals for syntheses are not included.
・All charges listed here are including tax.
Nanofabrication(MEMS)
【Open Project】
■Technical support fee: 3,150 yen/hour  
■Facility usage charge: 860 yen/hour(670 yen/hour for the use within the Universityr )

【Classified Project】
■Technical support fee: 5,565 yen/hour  
■Facility usage charge: 860 yen/hour(670 yen/hour for the use within the Universityr )

Price List(PDF)
No.
Equipment name
Charges
(yen/hour)
No.
Equipment name
Charges
(yen/hour)

A.Cleaning & drying

A-1
Etching chamber
705
A-6
Brush scrubber
3,922
A-2
Phosphate bath
1,029
A-7
Spin-drying machine
1,603
A-3
CO2ultra-critical drying machine
740
A-8
Organic draft chamber
705
A-4
Inert oven
(sinter furnace)
649
A-9
4" spin drying machine
1,338
A-5
Vacuum oven
3,922
A-10
6"spin drying machine
1,338

B.Photolithography

B-1
Pattern generator
1,524
B-10
Spin coater
2,585
B-2
Spin coater
1,475
B-11
Spray development equipment
1,629
B-3
Clean oven
1,861
B-12
Stepper
1,379
B-4
Polyimide cure furnace
1,247
B-13
ELIONIX EB drawing equipment
6,869
B-5
Double-sided aligner
2,369 B-14
Laser writer
6,570
B-6
One-sided aligner
1,566 B-15
Maskless exposure system for ball
3,750
B-7
Reith EB drawing equipment
3,015 B-16
Maskless exposure system for ball
1,603
B-8
Development draft
705 B-17 Hot plate 578
B-9
UV-curing equipment
1,886      

C.Oxidation/diffusion, ion injection and heat treatment

C-1
Oxidation furnace (for semiconductors))
8,851
C-7
Annealing furnace
8,225
C-2
Oxidation furnace (for MEMS)
7,447
C-8
Medium-current ion injector
17,214
C-3
P diffusion furnace
9,919
C-9
High-current ion injector
17,410
C-4
P push-in furnace
8,243
C-10
Rapid thermal annealing
6,694
C-5
B diffusion furnace
8,955 C-11
Metal diffusion furnace
8,027
C-6
B push-in furnace
8,243  

D.Deposition

D-1
LPCVD(SiN)
8,848
D-11
Plating equipment
2,085
D-2
LPCVD(Poly-Si)
10,005
D-12
MOCVD
18,461
D-3
LPCVD(SiO2)
10,971
D-13
JPEL PECVD
13,808
D-4
CVD
16,973 D-14
TEOS PECVD
15,323
D-5
SUMITOMOSEIMITU PECVD
13,685 D-15
Automatic Shibaura
sputtering
5,505
D-6
W-CVD
8,401
D-16
球面成膜用スパッタ装置
3,530
D-7
ANELVA sputtering equipment
6,158 D-17
多元材料原子層堆積(ALD)装置
8,988
D-8
SHIBAURA sputtering equipment
3,045
D-18
酸素加圧RTA付高温スパッタ装置
10,561
D-9
Electron beam evaporator
4,599 D-19
アネルバマルチスパッタ
6,578
D-10
Sol-gel auto-deposition system
6,361
   

E.Etching

E-1
DeepRIE #1
7,390
E-11
KOH etching equipment
2,638
E-2
DeepRIE #2
7,390
E-12
TMAH etching equipment
2,646
E-3
DeepRIE #3
7,674
E-13
DeepRIE #4
13,709
E-4
ANELVA RIE equipment
6,082
E-14
Ion milling
10,675
E-5
ANELVA Si RIE equipment
5,841
E-15
DeepRIE装置#4
6,957
E-6
Al-RIE
9,415
E-16
イオンミリング装置
13,655
E-7
ULVAC ashing equipment
3,206
E-17
ケミカルドライエッチャー(CDE)
5,442
E-8
BRANSON ashing equipment
2,558
E-18
プラズマクリーナー
2,717
E-9
ECR etching equipment
15,732  
E-10
ULVAC multi-purpose RIE equipment
8,230  

F.Bonding, polishing and packaging

F-1
Wafer bonding equipment
4,546
F-9
EVG wafer bonder
4,678
F-2
TOKYO SEIMITSU dicer
8,841
F-10
EVG aligner for wafer bonding
3,915
F-3
DISCO dicer
1,888
F-11
UV imprint
5,112
F-4
Wire bonder
776
F-12
Thermal imprint
4,750
F-5
Laser marker
1,969
F-13
Excimer lamp cleaner
1,077
F-6
6-inch wafer polishing equipment
1,679
F-14
Surface planer
11,842
F-7
4-inch wafer polishing equipment
1,394
F-15
Shibuya LAMICS AQL-1900
5,087
F-8
Sand blast
2,734

G.Measurement

G-1
Wafer dust detector
1,323
G-15
Ultrasonic microscope
1,810
G-2
Film thickness gage
960
G-16
Digital thermo microscope
833
G-3
Dektak step profiler
1,237
G-17
Infrared microscope
818
G-4
Tenchor step profiler
1,237
G-18
Quadrupole mass analyzer
813
G-5
Depth measuring equipment
666
G-19
TOF-SIMS
14,247
G-6
4-probe measuring equipment
667
G-20
Quick coater
933
G-7
Spreading resistance profiler
2,180
G-22
Desktop Ellipsometer
344
G-8
Wafer prober
2,217
G-23
Large wafer size AFM
3,592
G-9
Metal microscope
741
G-24
Laser/white light conforcal microscope
4,491
G-10
Digital microscope
1,168
G-25
Line-focus-beam acoustic microscope for material characterization #1
3,823
G-11
Thermal electron SEM
2,208
G-26
Line-focus-beam acoustic microscope for material characterization #2
3,823
G-12
FE-SEM
3,678
G-27
FIB
8,773
G-13
Micro X-ray CT
2,620
G-28
XRD
6,822
G-14
Ellipsometer
563  
※Nanofabrication:All charges listed here are including tax.