nanotech_japan

Equipment&Charges

■Microstructural Characterization   ■Molecule & Material Synthesis
■Nanofabrication(MEMS)   

Microstructural Characterization
■Technical support charge: 3,000 yen/hour
■Sample preparation room:300yen/hour
Equipment usage Charges【yen/day(8hours)】
Equipment name
Open Project
Classified Project
SU8000
10,512 29,248
FEI-Titan80-300
29,705 34,105
FEI−Quanta3D
23,120 33,112
FEI−Versa3D
23,120 33,112
JEM-ARM200F
24,000
64,480
JEM-3010
14,942 25,654
※Microstructural Characterization:All charges listed here are before tax.
Molecule & Material Synthesis
Equipment name
Charges
 
Consumables
costs
Open Project
Classified Project
 
Independent Operation
Assistant Operation
Integrated Support
Independent Operation
Assistant Operation
Integrated Support
 
Separately negotiated
Types of synthetic equipment and analyzers
1,220 8,672
yen/
day
Triple Glove Box with Deposition Chanber
2,613 3,606 4,103 3,358 3,855 5,097
yen/
hour
Degital Camera
Optical Thickness Meter
Manual Positioner
Semiconductor Device Analyzer
Thermoanalysis
238 1,231 1,728 983 1,480 2,722
yen/
hour
Absolute PL Quantum Yield Measurment System
334 1,327 1,824 1,079 1,576 2,818
yen/
hour
Photoemission Yield Spectroscopy in Air
1,042 2,036 2,533 1,787 2,284 3,526
yen/
hour
Time of Flight Carrier Measurement System
627 1,621 2,118 1,373 1,869 3,111
yen/
hour
X-ray Diffractometer
1,247 2,241 2,738 1,993 2,489 3,731
yen/
hour
Nuclear magnetic resonance (NMR)
6,342
35,338
yen/
hour
ICP optical emission spectrometer
3,400
4,979
yen/
hour
Molecule & Material Synthesis
・Raw chemicals for syntheses are not included.
・All charges listed here are including tax.
Nanofabrication(MEMS)
【Open Project】
■Technical support fee: 3,150 yen/hour  
■Facility usage charge: 880 yen/hour(690 yen/hour for the use within the Universityr )

【Classified Project】
■Technical support fee: 5,565 yen/hour  
■Facility usage charge: 880 yen/hour(690 yen/hour for the use within the Universityr )

Price List(PDF)
No.
Equipment name
Charges
(yen/hour)
No.
Equipment name
Charges
(yen/hour)

A.Cleaning & drying

A-1
Etching chamber
648
A-6
Brush scrubber
2,811
A-2
Phosphate bath
683
A-7
Spin-drying machine
1,263
A-3
CO2ultra-critical drying machine
1,394
A-8
Organic draft chamber
648
A-4
Inert oven
(sinter furnace)
568
A-9
4" spin drying machine
927
A-5
Vacuum oven
501
A-10
6"spin drying machine
927

B.Photolithography

B-1
Pattern generator
1,524
B-9
UV-curing equipment
1,886
B-2
Spin coater
1,049
B-10
Spin coater
1,041
B-3
Clean oven
1,416
B-11
Spray development equipment
1,099
B-4
Polyimide cure furnace
1,060
B-12
Stepper
15,046
B-5
Double-sided aligner
2,165
B-13
ELIONIX EB drawing equipment
6,441
B-6
One-sided aligner
1,566 B-14
Laser writer
5,937
B-7
Reith EB drawing equipment
3,015 B-15
Maskless exposure system for ball
3,750
B-8
Development draft
648  

C.Oxidation/diffusion, ion injection and heat treatment

C-1
Oxidation furnace (for semiconductors))
6,035
C-7
Annealing furnace
6,203
C-2
Oxidation furnace (for MEMS)
6,035
C-8
Medium-current ion injector
15,172
C-3
P diffusion furnace
7,898
C-9
High-current ion injector
15,353
C-4
P push-in furnace
6,221
C-10
Rapid thermal annealing
5,477
C-5
B diffusion furnace
6,933 C-11
Metal diffusion furnace
5,381
C-6
B push-in furnace
6,221  

D.Deposition

D-1
LPCVD(SiN)
8,446
D-9
Electron beam evaporator
4,679
D-2
LPCVD(Poly-Si)
8,620
D-10
Sol-gel auto-deposition system
2,094
D-3
LPCVD(SiO2)
9,695
D-11
Plating equipment
16,354
D-4
CVD
10,639
D-12
MOCVD
12,488
D-5
SUMITOMOSEIMITU PECVD
12,064
D-13
JPEL PECVD
12,436
D-6
W-CVD
7,131 D-14
TEOS PECVD
5,027
D-7
ANELVA sputtering equipment
5,097 D-15
Automatic Shibaura
sputtering
3,270
D-8
SHIBAURA sputtering equipment
2,891
D-17
9,046
D-9
Electron beam evaporator
3,597
D-18
  10,089

E.Etching

E-1
DeepRIE #1
6,906
E-11
KOH etching equipment
2,817
E-2
DeepRIE #2
6,906
E-12
TMAH etching equipment
2,853
E-3
DeepRIE #3
7,135
E-13
DeepRIE #4
11,215
E-4
ANELVA RIE equipment
5,982
E-14
Ion milling
9,109
E-5
ANELVA Si RIE equipment
5,754
E-15
  6,708
E-6
Al-RIE
9,894
E-16
  8,037
E-7
ULVAC ashing equipment
2,955
E-17
  5,341
E-8
BRANSON ashing equipment
2,523
E-18
2,505
E-9
ECR etching equipment
10,739  
E-10
ULVAC multi-purpose RIE equipment
7,398  

F.Bonding, polishing and packaging

F-1
Wafer bonding equipment
3,612
F-9
EVG wafer bonder
4,457
F-2
TOKYO SEIMITSU dicer
7,328
F-10
EVG aligner for wafer bonding
3,790
F-3
DISCO dicer
1,800
F-11
UV imprint
4,317
F-4
Wire bonder
776
F-12
Thermal imprint
4,421
F-5
Laser marker
1,960
F-13
Excimer lamp cleaner
1,075
F-6
6-inch wafer polishing equipment
1,675
F-14
Surface planer
7,275
F-7
4-inch wafer polishing equipment
1,392
F-15
Shibuya LAMICS AQL-1900
3,980
F-8
Sand blast
1,912

G.Measurement

G-1
Wafer dust detector
1,323
G-15
Ultrasonic microscope
1,472
G-2
Film thickness gage
827
G-16
Digital thermo microscope
832
G-3
Dektak step profiler
1,107
G-17
Infrared microscope
754
G-4
Tenchor step profiler
1,107
G-18
Quadrupole mass analyzer
848
G-5
Depth measuring equipment
666
G-19
TOF-SIMS
10,099
G-6
4-probe measuring equipment
667
G-20
Quick coater
840
G-7
Spreading resistance profiler
1,856
G-21
Scanning probe microscope
2,951
G-8
Wafer prober
1,890
G-22
Desktop Ellipsometer
344
G-9
Metal microscope
677
G-23
Large wafer size AFM
2,943
G-10
Digital microscope
1,102
G-24
Laser/white light conforcal microscope
3,788
G-11
Thermal electron SEM
1,989
G-25
Line-focus-beam acoustic microscope for material characterization #1
3,291
G-12
FE-SEM
3,346
G-26
Line-focus-beam acoustic microscope for material characterization #2
3,291
G-13
Micro X-ray CT
2,231
G-27
FIB
3,058
G-14
Ellipsometer
455  
※Nanofabrication:All charges listed here are including tax.